BALL SHEAR CALIBRATION FIXTURE
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-12
Ball shear testing is used to test the bond quality of the gold thermosonic ball bonds which are made to IC devices during the wire bonding assembly process. Ball shear testing is used for process wntrol, wire bonder set-up and qualifica- tion. It is used in conjunction with wire pull tests because it is a direct measurement of the bond area which may be 6-10 times greater then the cross-section of the wire tested during wire pull. Figure 1 shows the ball shear test method.