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BALL SHEAR CALIBRATION FIXTURE

IP.com Disclosure Number: IPCOM000005841D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-12

Publishing Venue

Motorola

Related People

Authors:
Thomas A. Scharr Russell Lee

Abstract

Ball shear testing is used to test the bond quality of the gold thermosonic ball bonds which are made to IC devices during the wire bonding assembly process. Ball shear testing is used for process wntrol, wire bonder set-up and qualifica- tion. It is used in conjunction with wire pull tests because it is a direct measurement of the bond area which may be 6-10 times greater then the cross-section of the wire tested during wire pull. Figure 1 shows the ball shear test method.