Browse Prior Art Database

"PHERIPHERAL EDGE CONTACT IC PACKAGE" WITH OPTION II

IP.com Disclosure Number: IPCOM000005922D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-15

Publishing Venue

Motorola

Related People

Authors:
Michael B. McShane Paul T. Lin

Abstract

There are several desirable features related to high pin count IC packages such as low manufacturing cost, so&table and immunity to lead damage during handling, testing, burn in and board mounting. In order to achieve the above men- tioned features, plastic packages with peripheral edge contacts have been proposed and reduced to practice.