"PHERIPHERAL EDGE CONTACT IC PACKAGE" WITH OPTION II
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-15
There are several desirable features related to high pin count IC packages such as low manufacturing cost, so&table and immunity to lead damage during handling, testing, burn in and board mounting. In order to achieve the above men- tioned features, plastic packages with peripheral edge contacts have been proposed and reduced to practice.