Browse Prior Art Database

FARADAY SHIELD IMPLEMENTATION IN A POWER STACK FOR A HYBRID CIRCUIT

IP.com Disclosure Number: IPCOM000005923D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-15

Publishing Venue

Motorola

Related People

Authors:
John Herrmann H. (Samuel) No Kenneth Sikora

Abstract

Figure 1 shows a side view of the power stack for a hybrid circuit design. The multilayer substrate is composed of both alumina and copper layers, constructed using direct bond copper (DBC) technology. DBC technology is a method of bonding copper directly to a ceramic substrate, without an additional bonding layer. This technology is particularly useful in applications requiring low thermal resistance and high current carrying capability as it minimizes the number of thermal interfaces.