Browse Prior Art Database

CLAMPING SYSTEM FOR SIP WIRE BOND

IP.com Disclosure Number: IPCOM000005928D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-16

Publishing Venue

Motorola

Related People

Authors:
Chan Mun Leong Harris Fung

Abstract

Too many failures in post bonding wire pull and peel tests due to inconsistent clamping of leadframes during bond- ing procedure. Any new designs are made difficult by space limitations and the awkward position of corner leads. The Solution Very firm and consistent lead clamping is accomplished by using a new clamping structure, portions of which are illustrated in FIG 1. The new clamping system includes individual spring finger clamps with knife edge contact pressure as shown by the side view of FIG. 2. This improved clamping results in good post-bonding, achieving wire pull Cpk >1.5 and 100% peel test acceptance.