Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-16
In a semiconductor pressure sensor (as shown in FIG. 1) a glass plate (2) has sputtered metalization layers of chrome (4) and nickel (6) on which is formed a solder bump (8) for subsequent electrical connection. Failure analysis of such devices showed that glass fracture occurred at the edge of the metalization layers.