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EXTENDED METALIZATION Disclosure Number: IPCOM000005935D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-16

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Thomas Bock


In a semiconductor pressure sensor (as shown in FIG. 1) a glass plate (2) has sputtered metalization layers of chrome (4) and nickel (6) on which is formed a solder bump (8) for subsequent electrical connection. Failure analysis of such devices showed that glass fracture occurred at the edge of the metalization layers.