DEVICE FOR SOLDER BOND ANALYSIS
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2001-Nov-16
The quality of the solder bonds in power devices is of prime importance for both performance and reliability reasons. Detailed observation of the bond characteristics is difficult. Common methods include X-ray techniques, selective chemical etch to expose the joint and destroying the device with the hope of exposing some of the bond interface. Presented here is an easier and more effective method for:characterizing the quality of solder bonds.