Browse Prior Art Database

LEADFRAME SOLUTION FOR HALF-BRIDGE POWER MODULE

IP.com Disclosure Number: IPCOM000005940D
Original Publication Date: 2001-Nov-16
Included in the Prior Art Database: 2001-Nov-16

Publishing Venue

Motorola

Related People

Authors:
Frank Rehme Fabien Malacarne

Abstract

A leadframe solution has been developed in the design of half-bridge module for high power applications. This solution provides answers to requirements associated to high volume productions such as cost effectiveness, reliability, compactness and modularity. The proposed design includes a solution to optimise the heat capacity of the copper section under the dies by attaching thick copper heatsinks on a core leadframe and forming them to run under this core leadframe. Other original features related to transfer moulding have also been tested on that large power module package such as stress relief grooves.