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PHYSICAL AND CHEMICAL PROPERTIES OF THIN METAL FILMS ON POLYETHERIMIDE

IP.com Disclosure Number: IPCOM000005970D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2001-Nov-21

Publishing Venue

Motorola

Related People

Authors:
Lynn Davis Marc Papageorge

Abstract

The exceptional combination of electrical, thermal, physical and chemical pmperties found in polyetherimide (PEI) resins make them particularly suited for printed circuit board (PCB) applications. PEI resins are noteworthy for their low dissipation factor at high frequencies, which makes the material ideal for use in micmwave applications. The key to making high quality PCBs from PEI is a thorough understanding of the factors influencing metal/PEl adhesion. A strong metal/polymer interaction is desirable in order to achieve optimum metal adhesion. This study utilizes X-ray Photo- electron Spectmscopy (XPS) to characterize the chemical interactions between PEI and three metals, copper, chromium, and nichmme (80% Ni, 20% Cr.).