Browse Prior Art Database

SUBSTRATE FOR ELECTRONIC COMPONENTS

IP.com Disclosure Number: IPCOM000005977D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2001-Nov-21

Publishing Venue

Motorola

Related People

Authors:
Xavier Sheehy Ted Grzeskowiak Larry Osburn Mark Fulcher

Abstract

A polyimide and aluminum substrate is described that is preferably fabricated using standard integrated circuit photolithography liftoff methods rather than etching techniques. A prior substrate construction contains alternating layers of copper (conductor) and polyimide (dielectric) separated and attached using continuous sheets of adhesive. Vias and through holes are made by etching or drilling the copper/polyimide composite, and electroplating copper to complete the interconnect. The resultant packet of layers of copperlpolyimide is then glued to an aluminum heatsink. This prior construction is a tradeoff of thermal performance, circuit/interconnect density, manufacturability and cost.