Browse Prior Art Database

DOUBLE LAYER RECESSED HYBRID FLIP CHIP ON BOARD

IP.com Disclosure Number: IPCOM000006032D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2001-Nov-27

Publishing Venue

Motorola

Related People

Authors:
Marc Papageorge Francisco Alves Bruce Freyman

Abstract

A multilayer double sided metallized tape is used to place a Flip Chip device on one side and active or passive components on the other side for applications requiring high interconnect density substrates. The circuit provides near zero IC height profile and increases the use of automatic assembly operations.