DOUBLE LAYER RECESSED HYBRID FLIP CHIP ON BOARD
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2001-Nov-27
A multilayer double sided metallized tape is used to place a Flip Chip device on one side and active or passive components on the other side for applications requiring high interconnect density substrates. The circuit provides near zero IC height profile and increases the use of automatic assembly operations.