Dismiss
InnovationQ and the IP.com Prior Art Database will be updated on Sunday, December 15, from 11am-2pm ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

ORGANIC SUBLAYER FOR ENDPOINT DETECTION

IP.com Disclosure Number: IPCOM000006057D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2001-Nov-29

Publishing Venue

Motorola

Related People

Authors:
John Helbert Jeffrey Pearse Clarence Tracy John Vogel

Abstract

Etchback planarization is an integral part of many wafer processing operations. It is widely used in multilevel metallizations and trench isolations. The typical process utilizes a 1:l plasma etchback chemistry for the organic overcoat, e.g. photoresist, to the oxide dielectric. Stopping the etch prior to exposing the underlying structures is not an easily controllable task. By adding a optically different organic between the oxide and the organic overcoat, a laser reflectometer endpoint signal can be obtained. The application of this technique is described in the following.