USE OF COMPACT LIQUID TO AIR HEAT EXCHANGER SYSTEMS IN PC'S AND WORKSTATIONS
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2001-Nov-30
A compact liquid to air heat exchanger (LAHE) system is used to cool semiconductor packages in small movable personal computers and workstations. Referring to FIG. 1, the compact LAHE system components consist of: (1) a compact liquid to air heat exchanger core (tube and shell, tube and fin or plate and fin), (2) a fan which pushes cooling air through the heat exchanger fins, (3) and a pump which circulates a liquid cooling in a closed loop of tubing between cooling channels in the heat exchanger and heatsink channels in thermal contact with a heat dissipating electronic package, (4) a pressure control (relief) valve, (5) a liquid volume expansion chamber (either bellows or piston accumulator), and (6) an external housing to enclose the system in a compact self contained configuration. Thermoelectric cooler modules 6, detailed in FIG. 2, may optionally be used to chill the liquid coolant.