TECHNIQUE TO UNIQUELY MONITOR PHOTOLITHOGRAPHY DEFECTIVITY
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2001-Dec-04
Defects due to particles tend to be the major source of yield loss in integrated circuits. The early detection and elimination of any source of particles can result in substantial increases in die yield. One area that is highly prone to this type of particle/defect related yield loss is the patterning of metal lines. This type of defect can cause opens or shorts in metal lines. In addition, any lithography related defect can impact many portions of the process since wafers are subjected to a lithography step more than any other step in the total flow.