Browse Prior Art Database

AN ALTERNATE EXTERNAL LEAD-TO-HEATSINK GROUNDING METHOD

IP.com Disclosure Number: IPCOM000006105D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2001-Dec-04

Publishing Venue

Motorola

Related People

Authors:
Ted Golubic Tim Olson

Abstract

The basic IC power circuit, packaged in a single in-line package (SIP) or other similar package, requires silicon-to-heatsink and heatsink-to-external lead interconnection for efficient circuit design. The silicon-to-heatsink connections are typically accomplished through wire bonds from the circuit bonding pads to the heatsink, hereinafter termed "down-bonds".