Browse Prior Art Database

EPOXY PACKAGE FOR PRESSURE SENSOR

IP.com Disclosure Number: IPCOM000006138D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2001-Dec-06
Document File: 1 page(s) / 44K

Publishing Venue

Motorola

Related People

Authors:
Victor J. Adams

Abstract

Low cost pressure sensor packages are typically molded from thermoplastic polymers and their thermal and mechanical limitations are of concern in certain applications. However, sensor packages molded from thermoset polymers significantly improve on these limitations.