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Optimization Technique for Lithography and Etch Processes on Device Shrinks

IP.com Disclosure Number: IPCOM000006139D
Original Publication Date: 2001-Dec-06
Included in the Prior Art Database: 2001-Dec-06
Document File: 2 page(s) / 22K

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Karl Mautz: AUTHOR [+3]


Optimization Technique for Lithography and Etch Processes on Device Shrinks

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Optimization Technique for Lithography and Etch Processes on Device Shrinks

Karl Mautz, Alain Charles and John Maltabes

The measure of success during the construction of next generation devices is often difficult to determine due to a lack of a suitable reference.  As a consequence, the optimization of specific structures or layouts used to build these devices is impeded.  The objective is to obtain electrical data of the aggressive and existing device features, side by side on a wafer that has been processed identically. This can be accomplished by optionally providing these features on existing reticles used for construction of well-characterized (electrically) devices.   As a side benefit, process optimization can also be done during this testing.  

This technique will allow the testing of the next generation devices or ground rules on reticles without having to build the reticle to full specification, thus saving the expense of this.  The technique can be done with existing product reticles and feature sizes serving as a standard.  Shrinks on these mask features would be done to compare data on specific features sized 1 device generation ahead, primarily on the problematic device layers, such as gate mask levels.  A reticle would be built with these variously sized features located on different areas of the reticle field.  These reticles would be used to print wafers.

An algorithm is used to randomly select predetermined transistors or other features on the wafer.  This is done to eliminate known pattern dependency and topography effects.  Ideally, the targeted areas (collection of features) should be segmented on the device/reticle for this characterization.  Repeating this process using multiple shrinks could be done by blading off the reticle (leaving...