Browse Prior Art Database

Customizable Half Tone Mask Disclosure Number: IPCOM000006140D
Original Publication Date: 2001-Dec-06
Included in the Prior Art Database: 2001-Dec-06
Document File: 1 page(s) / 21K

Publishing Venue


Related People

Karl Mautz: AUTHOR [+1]


Customizable Half Tone Mask

This text was extracted from a Microsoft Word document.
This is the abbreviated version, containing approximately 57% of the total text.

Customizable Half Tone Mask

Karl Mautz and John Maltabes

Manufacturing of reticles is challenged by the reduction of feature size variation, increased resolution, and improved overlay control for positioning of features on the reticle substrate.  These become increasingly difficult in manufacturing reticles for sub-0.35um device technologies.  Other reticle manufacturing techniques such as optical proximity correction or phase shift masks adds additional complexity and cost to the reticles.

Producing patterned features on wafers with a reduced resist thickness (after coating using a standard thickness) is problematic, but is necessary for processing aggressive shrinks of device features.  This method enables the partial exposure of photoresist that is needed to remain as a partial pattern on the wafer at a controllable thickness.  This can be done for ion implantation modulation processes, or for Zero mask level feature definition.

This method is done by producing a mask that uses a gray scale filter (thin quartz blank or plates), that are added to the standard reticle mask.  Multiple versions of the gray scale filters can be produced, each having a different shade (level of grayness).  The fabrication of these gray scale filter masks is relatively easy.  The filter plate is added to the glass side of the reticle to modulate the exposure processing.  To characterize the results, the reticle can be combined with different shade levels filters, each combination being used to print waf...