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Motorola
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Abstract
This invention consists of chilling a platten for the intermediate polishing of cross-sections. The platten can be made of any material. The cooling of the platten can be accomplished by either of two methods. The first method consists of pouring a cold liquid such as liquid nitrogen along the edge of the platten in the bowl. The second method consists of internally cooling the platten with a chilled liquid. The purpose of chilling the platten is to remove the heat generated during polishing from the sample surface in order to reduce and eliminate the amount of smearing and mechanical/plastic deformation of soft low-melting point materials. This invention was developed for use in the Minimet' polisher by Buehler, Ltd. but can be used for any size platten.
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MO7WROLA INC. Technical Developments Volume 12 April 1991
CHILLED STAGE FOR CROSS-SECTION SAMPLE PREPARATION
by David J. Burkhard
This invention consists of chilling a platten for the intermediate polishing of cross-sections. The platten can be made of any material. The cooling of the platten can be accomplished by either of two methods. The first method consists of pouring a cold liquid such as liquid nitrogen along the edge of the platten in the bowl. The second method consists of internally cooling the platten with a chilled liquid. The purpose of chilling the platten is to remove the heat generated during polishing from the sample surface in order to reduce and eliminate the amount of smearing and mechanical/plastic deformation of soft low-melting point materials. This invention was developed for use
in the Minimet' polisher by Buehler, Ltd. but can be used for any size platten.
This invention is used in the following manner. A polishing cloth is placed onto the platten and the platten is cooled. The temperature required is not critical but temperatures below freezing seem to do better. Polishing compound is added to the cloth with an appropriate lubricant that will not freeze on the polishing cloth. The surface of the sample after this step is very planar across all the materials present with minimal embedding of polishing compound into the soft low-melting point materials.
Method 1: LN2 poured along side of
Method 2: Platten is internally cooled.
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