Dismiss
InnovationQ and the IP.com Prior Art Database will be updated on Sunday, December 15, from 11am-2pm ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

REPAIRABLE MULTI-CHIP MODULES

IP.com Disclosure Number: IPCOM000006174D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2001-Dec-11

Publishing Venue

Motorola

Related People

Authors:
Lonnie Bernardoni Ken Thompson

Abstract

In today's consnmer electronic industry, reducing product size is a key initiative. A significant and ever increasing portion of the useable volume is needed for integrated circuits (ICs) and their protective packages. One commonly understood method of reducing the overall space needed for chip carriers is combining two or more KS onto a single substrate. For instance, a 80 I/O IC utilizing the latest in pad array solder attach technology takes about 0.60" of board surface.