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COMPACT HEATSINK Disclosure Number: IPCOM000006175D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2001-Dec-11

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Ravi Bhatla


The miniaturization trend has put greater pressure on the reduction of heatsink size in electronic pack- ages. A generic design of a Compacr Heatsink and its thermal superiority over the conventional heatsink has been experimentally confirmed. 2' Factorial experiments were done to further ascertain the thermal reliability of one Compact Healsink design for low power Land Mobile products.