Browse Prior Art Database

SELECTIVELY CONDUCTIVE ADHESIVE INTERCONNECT

IP.com Disclosure Number: IPCOM000006205D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2001-Dec-13
Document File: 1 page(s) / 45K

Publishing Venue

Motorola

Related People

Authors:
Frank Juskey Bruce Freyman Anthony Suppelsa

Abstract

The selectively conductive interconnect system is a method of using a conductive adhesive that is con- ductive only in key areas where electrical or thermal conductivity is required. This adhesive system is designed to replace metal alloys for many applications in electronics. Depicted in the blow-up drawing below is the interconnection of a flip chip die (A) to a printed circuit board (PCB) (C) using an anisotropic adhesive (B) that is conductive only in the areas where the bumps on the bottom of the die and the corre- sponding pads on the PCB are located.