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HIGH TEMPERATURE THERMOPLASTIC SUBSTRATE HAVING A VACUUM DEPOSITED SOLDERABLE ELECTRICAL CONDUCTOR

IP.com Disclosure Number: IPCOM000006233D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2001-Dec-17
Document File: 2 page(s) / 110K

Publishing Venue

Motorola

Related People

Authors:
Dale W. Dorinski Glenn F. Urbish Anthony B. Suppelsa

Abstract

There are a number of thermoplastic materials that can be molded or otherwise formed into shapes for printed circuit substrates. To be a suitable material for a printed circuit substrate, the material must be able to withstand soldering temperatures. High tem- perature thermoplastic materials that meet this require- ment have a heat deflection temperature of 170°C or greater, for example, polyetherimide (PEI), polysul- fone, polyethersulfone, polyamideimide, polyarylsul- fone, polyarylate, polyetheretherketone, poly- butyleneterephthalate, and blended combinations of these.