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LOW PROFILE BACKPLANE INTERCONNECT

IP.com Disclosure Number: IPCOM000006258D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2001-Dec-19

Publishing Venue

Motorola

Related People

Authors:
Raul Olivera

Abstract

As the thrust towards miniaturization continues, the thermal density of electronic equipment will con- tinue to increase. There is also a need to stack equip- ment to minimize the use of space. In these cases, it is desirable to direct the airflow from front to back; otherwise the rising hot air will overheat the top units in the stack.