Method for minimizing thermal interface material spread by using a heat spreader
Publication Date: 2001-Dec-19
The IP.com Prior Art Database
During technology development, a new reliability failure mechanism was discovered in which the solder on the die-side capacitors (DSC) would bridge and short to the heat spreader during the attachment of the interposer. The root cause of the failure mechanism was identified as TIM spreading onto the DSCs. During a surface mount reflow the thermal interface material on the DSC expands, and the solder melts and is pushed on top of the capacitor (see Figure 2). Preventing solder doming during surface mount reflow requires the integrated heat spreader (IHS) module to significantly reduce the amount of TIM spread while ensuring complete die coverage and good reliability performance.