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Method for a socket with added solder materials for load bearing

IP.com Disclosure Number: IPCOM000006270D
Publication Date: 2001-Dec-19
Document File: 3 page(s) / 398K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a socket with added solder materials for load bearing. Benefits include increased support area and decreased load stress per solder sphere and socket housing area.