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Method for package land designs for removing impedance discontinuities in the I/O signal path

IP.com Disclosure Number: IPCOM000006274D
Publication Date: 2001-Dec-19
Document File: 3 page(s) / 57K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for package land designs for removing impedance discontinuities in the I/O signal path. Benefits include reduced impedance discontinuities, improved bandwidth and improved I/O transmission speed.