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Method for a flip-chip bump pull test method using a soldered copper wire Disclosure Number: IPCOM000006276D
Publication Date: 2001-Dec-19
Document File: 3 page(s) / 38K

Publishing Venue

The Prior Art Database


Disclosed is a method for a flip-chip bump pull-test method using a soldered copper wire. Benefits include evaluation of bump integrity without the use of a dedicated tool.