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Method for an integrated heat spreader with a pre-applied sealant adhesive

IP.com Disclosure Number: IPCOM000006281D
Publication Date: 2001-Dec-19
Document File: 2 page(s) / 47K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for attaching an integrated heat spreader with a pre-applied sealant adhesive. Benefits include reduced dynamic warpage of the package during thermal cycling, reduced stress on the thermal interface, and improved control of sealant placement and flow. The disclosed method is an IHS with pre-attached B-stage or solder sealant adhesive polymer dispensed on to the surface of the IHS lip for bonding the spreader to the package (see Figure 2). The sealant reduces dynamic warpage of the package during thermal cycling and reduces the stress load on the thermal interface.