MULTI-METAL BALL BUMPS FOR INTEGRATED CIRCUIT FLIP CHIP INTERCONNECTIONS
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2001-Dec-20
Multi-metal bumps bonded to integrated circuit chip bond pads will facilitate the interconnection of the cir- cuits to multi-chip module substrates. A multi-metal bump is comprised of a tin-lead bump which is bonded on top of either a copper or gold bump on an aluminum metal bond pad of the circuit. The copper or gold and the solder bumps are bonded to the chips with an auto- matic wire bonder. The chips with the multi-metal bumps are "flip-chip" bonded to the multi-chip module using a standard solder reflow process.