GLOBAL ILD PLANARITY WITH A LOW DIELECTRIC CONSTANT POLYIMIDE
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2001-Dec-24
This invention simplified the process used to achieve global planarity of polyimide tihns used as insulating layers in multilayer metal devices. In addition, global planarity can be achieved with new low dielectric con- stant polyimide formulations by integrating these mate- rials with existing process technology.