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SELF-CENTERING PAD DESIGN FOR SOLDER CLADDING UNDER ROUND COMPONENTS

IP.com Disclosure Number: IPCOM000006315D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2001-Dec-24
Document File: 2 page(s) / 92K

Publishing Venue

Motorola

Related People

Authors:
Ralph R. Kolle Kiron R Gore Edward J. Hall

Abstract

With the addition of solder cladding as a viable process for PCB assembly, a new problem emerges for tubular components such as fuses, glass diodes, or melfs. Solder cladding produces crowned or rounded pad surfaces. Placement of a tubular part on top of a crowned pad will result in the part rolling off. One way to prevent this would be to flatten the pads prior to placement, but a flattening process would be extremely diff%xlt to control and would also require special equipment.