SELF-CENTERING PAD DESIGN FOR SOLDER CLADDING UNDER ROUND COMPONENTS
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2001-Dec-24
With the addition of solder cladding as a viable process for PCB assembly, a new problem emerges for tubular components such as fuses, glass diodes, or melfs. Solder cladding produces crowned or rounded pad surfaces. Placement of a tubular part on top of a crowned pad will result in the part rolling off. One way to prevent this would be to flatten the pads prior to placement, but a flattening process would be extremely diff%xlt to control and would also require special equipment.