SF6/02 PLASMA ETCH AND CONTAMINATION ETCH
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2001-Dec-27
The mechanically thinning (back grinding or lap- ping) of silicon wafers near the end of the process flow, permits the majority of the wafer semiconductor processing steps to be performed with thicker wafers (>20 mils) which are more resistant to breakage. The thinning step usually reduces wafer thicknesses to a range of 11 to 15 mils, or less.