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Method for a PC-chassis design with an enclosed TEC﷓cooled module

IP.com Disclosure Number: IPCOM000006373D
Publication Date: 2001-Dec-28
Document File: 8 page(s) / 183K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a PC-chassis design with an enclosed TEC-cooled module. Benefits include improved temperature reduction.