Browse Prior Art Database

Method for reduced evaporation thermal resistance of heat pipe by using stepped wall/wick thickness in an evaporative heat transfer section

IP.com Disclosure Number: IPCOM000006384D
Publication Date: 2001-Dec-28

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for reduced evaporation thermal resistance of heat pipe by using stepped wall/wick thickness in an evaporative heat transfer section. Benefits include improved cooling.