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Disclosed is a method for reduced evaporation thermal resistance of heat pipe by using stepped wall/wick thickness in an evaporative heat transfer section. Benefits include improved cooling.
English (United States)
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76% of the total text.
Method for reduced evaporation thermal resistance of heat
pipe by using stepped wall/wick thickness in an evaporative heat transfer
Disclosed is a method for reduced evaporation thermal resistance
of heat pipe by using stepped wall/wick thickness in an evaporative heat
transfer section. Benefits include improved cooling.
the cooling of high heat-flux electronic devices, use of a heat pipe is widely
considered, which enhances heat spreading along its length. To maximize thermal
performance of the heat pipe, every component of the total thermal resistance
should be optimized. One of the key thermal resistances is the evaporation
resistance, which occurs in evaporative region of the heat pipe.
resistance combines phase-change resistance and conduction resistance through
the heat pipe wick thickness.
all of the existing heat pipe designs, a uniform wick thickness is used
throughout the whole heat pipe length.
However, it is known that the minimum wick thickness is preferable for
evaporative thermal resistance, as long as the capillary pumping capability of
the wick thickness is assured for the design power. In addition, in evaporative
region of the heat pipe, thicker copper wall thickness is preferable, which helps
spread heat, and hence, extend evaporative heat transfer area.
disclosed method utilizes different wall/wick thickness between the evaporative
region and the other section of the heat pipes (see Figures 1, 2, and...