Browse Prior Art Database

SURFACE MOUNT PACKAGE ADHESION IMPROVEMENT

IP.com Disclosure Number: IPCOM000006465D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2002-Jan-07

Publishing Venue

Motorola

Related People

Authors:
Bill Miller Bill Taylor Scott Chang

Abstract

Surface mount devices are typically mounted to printed circuit boards using automated equipment. The plastic package is located on the PC board and often a polymer adhesive, such as epoxy, is used to attach the package to the board prior to and during the actual soldering operation.