Browse Prior Art Database

LOW PROFILE IC PACKAGING METHOD

IP.com Disclosure Number: IPCOM000006473D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2002-Jan-07

Publishing Venue

Motorola

Related People

Authors:
Leonard Morton Lehrer Peter Bradford Gilmore

Abstract

When a new customer reviews a portable radio, cape- If a cutout were provided in the last or last two outer cially when being compared to competitive products, layers, high profile components of height h, could be the first feature noticed is size. It is vital that Motorola selectively placed within these pockets (see Figure 21, maintains its competitive edge in all areas including the thus reducing the impact of their physical size. volume/size of the product.