ADVANCES IN TEM SPECIMEN PREPARATION
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2002-Jan-11
Transmission electron microscopy [TEM] is an ana- lytical technique that involves propagation of electron beams through a thin foil of material. The transmitted beams contain information that make possible the anal- ysis and study of(i) microstructure of device-structures, semiconductor, metal, or insulating layers, (ii) continu- ity of layers, including the. presence of pin-holes or islanding, (iii) quality of interfaces, (iv) material interac- tions such as phase-reactions, corrosion, action of dihit- sion barriers and glue layers in device-structures, (v) defects such as dislocations, grain-boundaries, twins, pre- cipitates, stacking faults in materials. For TEM analysis, thin-foil specimens (h lo-500 nm thick) have to be pre- pared in plan-view (for plan-view TEM), or in cross- section (for cross-section TEM), from the materials of interest; the resulting foils have to be electron transpar- ent. This paper presents advances in TEM specimen preparation in three areas (i) preparation ofmultiple plan- view TEM specimens, (ii) preparation of multiple cross- section TEM [XTEM] specimens, and (iii) preparation of specific-feature XTEM specimens.