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Browse Prior Art Database

SOLDER EMBOSSED PCB LOCATION FOR DEBOSSED COMPONENT

IP.com Disclosure Number: IPCOM000006544D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2002-Jan-14
Document File: 2 page(s) / 69K

Publishing Venue

Motorola

Related People

Authors:
Alien David Hertz David Alan Tribbey Kenneth Cook

Abstract

Component substrates such as PGA and flat packs are normally aligned by vision and placed on wet solder paste which has been screen printed or stenciled on a PC board. The location of the component can be dis- turbed while the assembly is in transit from the point of placement through subsequent operations and reflow.