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Method for high-density routing and interconnection for flip chip packaging

IP.com Disclosure Number: IPCOM000006573D
Publication Date: 2002-Jan-15
Document File: 3 page(s) / 66K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for high-density routing and interconnection for flip chip packaging. Benefits include higher density signal trace routing on the package substrate and reduced die size.