NI-7% V/AG BACKMETAL PROJECT
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2002-Jan-16
Work has been done to develop the Ni-7%/Ag backmetal system. The purpose of this backmetal is to provide electrical and thermal contact between the die and the package. Many different backmetal systems are currently in use. All of these using Ni and Ag also have a barrier metal in between the Ni layer and the die. The purpose of this barrier metal layer is to prevent any di- fusion or reaction between the Ni and the Si die.