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Three-Ply Foil For Fabrication Of Embedded Resistors Disclosure Number: IPCOM000006600D
Original Publication Date: 2002-Jan-16
Included in the Prior Art Database: 2002-Jan-16

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Gregory J. Dunn


The invention is a three-ply foil comprising approximately 100 nm of highly resistive (1-20 kohm/square) Pt-SiO2 on approximately 100 nm of resistive (25-100 ohm/square) Ni-P on 5-40 micron Cu foil. The three-ply foil can be patterned selectively to yield Cu traces, Ni-P resistors, and Pt-SiO2 resistors, for a complete embedded resistor solution in one circuit board layer. The invention is not limited to Ni-P and Pt-SiO2 layers, but could comprise other resistive materials that offer high and low sheet resistances and can be patterned selectively with respect to copper and each other.