Browse Prior Art Database

Compliant Heat-Sink Attach Method for Substrate-Based Processors

IP.com Disclosure Number: IPCOM000006606D
Publication Date: 2002-Jan-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a design for providing a more consistent spring force to hold the substrate and/or substrate cover to the heat sink. The disclosed design integrates two spring elements into the fan or heat-sink assembly. The two internal springs can be coil, leaf, or wire springs, as needed to meet functional requirements. The internal, integrated springs are significantly easier to assemble than traditional spring-clip assemblies.