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Method for a low cost, self-aligned and bumpless process for IC chip packaging

IP.com Disclosure Number: IPCOM000006608D
Publication Date: 2002-Jan-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a low cost, self-aligned and bumpless process for integrated circuit (IC) chip packaging. Benefits include improved throughput and yield from a simplified process, decreased contamination and damage, and improved process extensibility.