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Method of controlling thermal interface material bond-line thickness to reduce thermal resistance in a semiconductor package

IP.com Disclosure Number: IPCOM000006613D
Publication Date: 2002-Jan-16
Document File: 3 page(s) / 58K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of controlling thermal interface material bond-line thickness to reduce thermal resistance in a semiconductor package. Benefits include reduced impedance, reduced filler size, and reduced resistance.