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Method for strip-based testing of chip scale packages for stacked die product applications

IP.com Disclosure Number: IPCOM000006615D
Publication Date: 2002-Jan-16
Document File: 3 page(s) / 566K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for strip-based testing of chip scale packages for stacked die product applications. Benefits include improved yield, and reduced cost.