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Method for added dielectric laminate PCB design for a socketless design for FCPGA package and motherboard direct contact assembly

IP.com Disclosure Number: IPCOM000006618D
Publication Date: 2002-Jan-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for added dielectric laminate printed circuit board (PCB) design for a socketless design for flip-chip pin grid array (FCPGA) package and motherboard direct contact assembly. Benefits include a simplified assembly process, improved electrical performance, and improved environmental support.