Browse Prior Art Database

VISION STENCIL INSPECTION TO ENSURE SOLDER PRINT QUALITY

IP.com Disclosure Number: IPCOM000006663D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2002-Jan-21
Document File: 1 page(s) / 53K

Publishing Venue

Motorola

Related People

Authors:
Richard Mangold Chris Becher Reed George

Abstract

One of the main variables in effective PC board assembly is the solder paste print quality. Methods of reliably inspecting solder print quality have historically been elusive. A common solder print defect is insutli- cient solder deposition, which is caused by solder paste remaining in the stencil openings upon snap-off, as opposed to being transferred to the PC board. This prob- lem becomes more pronounced with tine pitch solder printing.