VISION STENCIL INSPECTION TO ENSURE SOLDER PRINT QUALITY
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2002-Jan-21
One of the main variables in effective PC board assembly is the solder paste print quality. Methods of reliably inspecting solder print quality have historically been elusive. A common solder print defect is insutli- cient solder deposition, which is caused by solder paste remaining in the stencil openings upon snap-off, as opposed to being transferred to the PC board. This prob- lem becomes more pronounced with tine pitch solder printing.