Browse Prior Art Database

THERMALLY ISOLATED REFLOW PALLlET

IP.com Disclosure Number: IPCOM000006666D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2002-Jan-22

Publishing Venue

Motorola

Related People

Authors:
Richard Mangold Chris Becher Reed George

Abstract

In order to achieve a suitable reflow profde for high melting point (220-3OYC) solders in a standard SMT reflow furnace, the pallet design must be modified to reduce heat sinking from the product area without sac- riftcing support, positional accuracy, durability, or com- patibility with the existing manufacturing line tooling. A pallet of standard design, made of aluminum, will heat sink the circuit to the point where a special furnace is required for reflow of high temperature solders. Alter- native pallet materials, such as fiber composites, will not withstand the elevated temperatures required for such applications.