IN LINE SOLDER PASTE MONITORING SYSTEM
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2002-Jan-22
Solder paste properties (mesh, viscosity, tackiness, et cetera) play a key role in surface mount production quality; the changes in solder paste properties are related to the changes in the solder flux. The quality of the solder paste can be determined prior to use, but there is no known practical means of continuous monitoring of the solder paste in use. This paper describes a means to monitor solder paste quality while in use without contacting the printed substrate or removing solder paste from the stencil.