NEW TAB OUTER LEAD ASSEMBLY METHOD- TAB PAD GRID ARRAY CARRIER
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2002-Jan-22
The TAB Grid Array is a combination of TAB ILB and a pad grid array for the OLB. The inner leads make contact to the die and then fan out to a matrix of solder halls. The tape has two metal layers, one consists of the signal leads from the die to the outer lead area and the other consists of copper pads for the solder balls with thru holes to the signal layer. The tape is then laminated to a thin PCB. Aher the lamination step, solder balls are attached to the copper pads. The solder balls can have a pitch from .040" to .lOO!' A heat sink may be attached to the die and to the top of the PCB to increase the power dissipation of the package.